Workshop on packaging and integration challenges for micro & nano-enabled
19 January 2010
The UK Nanotechnology Knowledge Transfer Network (NanoKTN) is
holding its next micro and nano-enabled sensors workshop on 21 January
2010 at the Rutherford Appleton Laboratory (RAL), Didcot near Oxford.
This follows on from a series of collaborations with JEMI and the
Sensors & Instrumentation KTN.
The workshop will look at the challenges of integrating micro and
nano-enabled sensors into suitably packaged systems for real commercial
applications. Presentations from key players in the industry, including
Zarlink, Optocap and BAE Systems will highlight these market
opportunities when novel technologies are exploited.
Today, micro and nano-enabled sensors are a key part of many high
value product markets but their development presents unique and specific
challenges, especially to those in the medical, military and
communication sectors. However, the development of these sensors is
essential to enable greater functionality, efficiency and security in
high value product design.
A key challenge in the adoption of these technologies is being able
to connect the active sensor device or sub assembly to a general-purpose
circuit board or suitable probe device for onward product integration.
The Packaging and Integration Challenges for Micro & Nano-enabled
Sensors workshop has been designed to stimulate the formation of the
complete supply chain, for successful implementation of nanotechnology
in these industry sectors.
“This workshop will be looking at and evaluating all the issues of
the supply chain for the nanotechnology industry looking to supply the
packaging market,” explains Alec Reader, Director of the NanoKTN. “The
workshop will examine the challenges faced in designing, packaging and
integrating micro and nano-enabled sub-components into robust systems
and will be very relevant to any companies or individuals working in
The workshop will consist of a number of presentations, followed by a
group-discussion, aimed at exploring the key areas, which need to be
further addressed. A table-top exhibition will run throughout the day
offering unique opportunities to show-case products and services.
Delegates are also encouraged to join the speakers and organisers at the
pre-event dinner which will provide an exceptional opportunity to have
pre-event discussions and to network in more relaxed surroundings.
All sectors of the packaging supply chain are encouraged to register
for the workshop, to learn more about how the UK is developing
applications in the packaging field.
Further information can be found at